Selection of a solid layer for high-resolution acoustic imaging of IC packaging defects under dry-contact conditions

✍ Scribed by Hironori Tohmyoh; Masumi Saka; Tsuyoshi Akaogi

• Publisher: Elsevier Science
• Year: 2009
• Tongue: English
• Weight: 574 KB
• Volume: 41
• Category: Article
• ISSN: 0167-6636
• DOI: 10.1016/j.mechmat.2009.04.001