✦ LIBER ✦
Scanning electron microscopy study of the cross section of intermetallic compound in the solder ball on the plastic ball grid array package following reliability tests
✍ Scribed by Yeh-Fang Duann; Jen-Hung Chiang; Shung-Jim Yang; Hsun-Wen Chang
- Publisher
- Springer US
- Year
- 2005
- Tongue
- English
- Weight
- 221 KB
- Volume
- 34
- Category
- Article
- ISSN
- 0361-5235
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