In the anodic electropolishing of Cu. Pb, Sn, W, MO, Cd, Ag. Ti, U, In and Zn in anhydrous sulphamic-acid-formamide solutions, the polishing proceeds via formation of semiwnducting anodic films. It is shown that the solid state properties (eg band gaps, lattice energies) of these &ns may be correlated with electropolishing rates of these metals obtained from the potentiostatic polarization curves of Menzies, Marshall and Griffin. The theoretical signi&ance of these wrrelations is discussed. The analysis presented is similar in approach to our previous interpretation of anodic dissolution of 23 materials, moslly metals, in anhydrous hydrogen fluoride. The considerations developed here further support the previously presented viewpoint, namely, that in electroinorganic reactions involving solid reaction films, the solid state properties of these films influence profoundly the electrochemical behaviour of film-covered electrodes, R&m&--Au tours de l'&lectro-polissage anodique de Cu, Pb, Sn, W, MO, Cd, Ag, Ti, U, In ou Zn dans des solutions anhydres d'acide sulfamique-formamide, le processus s'etablit via la formation de films anodiques semi-conducteurs. On montre que les prop&t& de l'&at solide (par exemple: distances des bandes, energies reticulaires) de ces films peuvent ttre Ii&es aux vitesses d'&ctropolissage de ces m&aux, obtenues ii partir des courbes potentiostatiques de polarisation de Men&s, Marshall et Griffin. La signification theorique de ces relations est discutee. L'analyse ici pr&sent& s'apparente & une interpretation pr&c&dente relative & la dissolution anodique de 23 mat&iaux essentiellement des m&aux, dam l'acide fluorhydrique anhydre. De plus, les consid&ations ici d&velopp&s 6tayent le precedent point de vue des auteurs, selon lequel quand les reactions Blectro-inorganiques impliquant la formation de films, les propri&& d'Btat solide des dits films influencent profondkment le comportement dlectrochimique des 6lectrodes qui en sont recouvertes.