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Role of microstructure and mechanical properties in abrasion

โœ Scribed by Larsen-Basse, J.

Book ID
122622956
Publisher
Elsevier Science
Year
1990
Weight
510 KB
Volume
24
Category
Article
ISSN
0956-716X

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The chemo-mechanical polishing process CMP has received much attention recently because of its importance as a nano-scale finishing process for high value-added large silicon wafers, which are used in the production of integrated circuits. The process is not well understood at present. It is clearly