Role of film intrinsic stress in packaging of multi-layer microelectronic structures

✍ Scribed by Vijay Sarihan

• Publisher: Elsevier Science
• Year: 2006
• Tongue: English
• Weight: 795 KB
• Volume: 421
• Category: Article
• ISSN: 0921-5093
• DOI: 10.1016/j.msea.2005.10.011