✦ LIBER ✦
Robust titanate-modified encapsulants for high voltage potting application of multichip module/hybrid IC
✍ Scribed by Wong, C.P.; McBride, R.
- Book ID
- 114560506
- Publisher
- IEEE
- Year
- 1993
- Tongue
- English
- Weight
- 601 KB
- Volume
- 16
- Category
- Article
- ISSN
- 0148-6411
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