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RF/wireless interconnect for inter- and intra-chip communications

✍ Scribed by Chang, M.F.; Roychowdhury, V.P.; Liyang Zhang; Hyunchol Shin; Yongxi Qian


Book ID
119782094
Publisher
IEEE
Year
2001
Tongue
English
Weight
271 KB
Volume
89
Category
Article
ISSN
0018-9219

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## Abstract Two new on‐chip dipoles in standard 0.18‐μm CMOS are presented. The dipoles show higher inter‐chip transmission gain than traditional on‐chip meander dipole and smaller coverage than traditional on‐chip linear dipole. Comparison between the simulated and measured S11 of the on‐chip dipo