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Reversible thermal interfaces based on microscale dielectric liquid layers

✍ Scribed by Cha, Gilhwan; Ju, Y. Sungtaek

Book ID
120521961
Publisher
American Institute of Physics
Year
2009
Tongue
English
Weight
552 KB
Volume
94
Category
Article
ISSN
0003-6951

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## Abstract Thermally reversible nanostructured thermosetting materials are prepared for the first time by modification of an epoxy resin with 5 wt.‐% of an amphiphilic polystyrene‐__block__‐poly(ethylene oxide) block copolymer (PSEO) and 30 wt.‐% of a low‐molecular‐weight liquid crystal, 4__β€²__‐(h