Return loss of three types of arching bond wire structures for RF and microwave circuit applications
✍ Scribed by Hsing-Yi Chen; Chen-Hsien Tai
- Book ID
- 102518559
- Publisher
- John Wiley and Sons
- Year
- 2006
- Tongue
- English
- Weight
- 236 KB
- Volume
- 48
- Category
- Article
- ISSN
- 0895-2477
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✦ Synopsis
Abstract
The S‐parameters of a gold wire bonded in air to two microstrip lines are validated by measurements and HFSS software simulations at frequencies of 0.04–6 GHz. From simulation results and measurement data, it is found that an arching bond wire with a smaller arc angle can minimize the return loss. From simulations, it is also found that the return loss can be improved, and operation frequency shifts can be achieved by using multiple wires placed in parallel in bond wire arrays. © 2006 Wiley Periodicals, Inc. Microwave Opt Technol Lett 48: 1701–1704, 2006; Published online in Wiley InterScience (www.interscience.wiley.com). DOI 10.1002/mop.21807