Resin systems for encapsulation of microelectronic packages : H. Hirsch, Solid State Technology, August (1970), p. 48

• Publisher: Elsevier Science
• Year: 1971
• Tongue: English
• Weight: 113 KB
• Volume: 10
• Category: Article
• ISSN: 0026-2714
• DOI: 10.1016/0026-2714(71)90526-9