Research on the bonding of material paths in melted extrusion modeling

✍ Scribed by Yongnian Yan; Renji Zhang; Guodong Hong; Xiaomeng Yuan

• Publisher: Elsevier Science
• Year: 2000
• Weight: 260 KB
• Volume: 21
• Category: Article
• ISSN: 0261-3069
• DOI: 10.1016/s0261-3069(99)00058-8

✦ Synopsis

Melted extrusion modeling MEM is one kind of rapid prototyping technology which is widely used in many areas. The bonding between the material path in MEM is the key to prototypes' strength. To analyze the relationship between the bonding strength and the forming parameters easily, bonding potential, a variable which measures the bonding interface status, is proposed. The tensile experiments and the bonding potential calculations of test samples were done. The regression function between bonding potential and strength was obtained. According to the bonding potential analysis, this paper has presented the forming parameters determining rules.