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Removal of post-etch photoresist and sidewall residues using organic solvent and additive combined with physical forces

✍ Scribed by Q.T. Le; M. Claes; T. Conard; E. Kesters; M. Lux; G. Vereecke


Book ID
104052060
Publisher
Elsevier Science
Year
2009
Tongue
English
Weight
493 KB
Volume
86
Category
Article
ISSN
0167-9317

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