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Removal of HF/CO2 post-etch residues from pattern wafers using water-in-carbon dioxide microemulsions

✍ Scribed by Jae Mok Jung; Hullathy Subban Ganapathy; Haldorai Yuvaraj; Keith P. Johnston; Kwon Taek Lim


Publisher
Elsevier Science
Year
2009
Tongue
English
Weight
656 KB
Volume
86
Category
Article
ISSN
0167-9317

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