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Removal of Cu(II) by polypyrrole deposits on stainless steel mesh

✍ Scribed by Tian Ying; Yang Weishen; Yang Fenglin

Publisher
John Wiley and Sons
Year
2007
Tongue
English
Weight
395 KB
Volume
104
Category
Article
ISSN
0021-8995

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✦ Synopsis

Abstract

The reduction of Cu(II) in aqueous media by polypyrrole deposits on stainless steel mesh is examined in this work. The kinetics of Cu(II) reduction, the influence of temperature, and the possibility of the regeneration and reuse of polypyrrole for Cu(II) reduction have been investigated. The morphology of stainless steel mesh/polypyrrole electrodes has been monitored with scanning electron microscopy. The X‐ray diffraction technique has been used to detect the formation of metallic copper deposits on the surface of polypyrrole films. Β© 2007 Wiley Periodicals, Inc. J Appl Polym Sci 104: 629–633, 2007

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