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RELY: A physics-based CAD tool for predicting time-dependent hot-electron induced degradation in MOSFET's

✍ Scribed by Shiuh-Luen Wang; Neil Goldsman; Qi Lin; Jeffrey Frey


Publisher
Elsevier Science
Year
1993
Tongue
English
Weight
849 KB
Volume
36
Category
Article
ISSN
0038-1101

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