<p><span>This book explains mechanical and thermal reliability for modern memory packaging, considering materials, processes, and manufacturing.</span></p><p><span><br></span></p><p><span>In the past 40 years, memory packaging processes have evolved enormously. This book discusses the reliability an
Reliability of Microtechnology: Interconnects, Devices and Systems
โ Scribed by Johan Liu, Olli Salmela, Jussi Sarkka, James E. Morris, Per-Erik Tegehall, Cristina Andersson
- Publisher
- Springer
- Year
- 2011
- Tongue
- English
- Leaves
- 219
- Edition
- 1st Edition.
- Category
- Library
No coin nor oath required. For personal study only.
โฆ Synopsis
Reliability of Microtechnology discusses the reliability of microtechnology products from the bottom up, beginning with devices and extending to systems. The book's focus includes but is not limited to reliability issues of interconnects, the methodology of reliability concepts and general failure mechanisms. Specific failure modes in solder and conductive adhesives are discussed at great length. Coverage of accelerated testing, component and system level reliability, and reliability design for manufacturability are also described in detail.The book also includes exercises and detailed solutions at the end of each chapter.
๐ SIMILAR VOLUMES
This book explains mechanical and thermal reliability for modern memory packaging, considering materials, processes, and manufacturing. In the past 40 years, memory packaging processes have evolved enormously. This book discusses the reliability and technical challenges of first-level interconnect m