𝔖 Bobbio Scriptorium

✦ LIBER ✦

Reliability of interconnection for ultrasonic facedown bonding : S. Harada, G. Kamoshita and T. Fukurai. Proc. 21st Electronic Components Conf., Washington DC, USA, 10–12 May (1971), p. 303

Publisher: Elsevier Science
Year: 1972
Tongue: English
Weight: 111 KB
Volume: 11
Category: Article
ISSN: 0026-2714
DOI: 10.1016/0026-2714(72)90727-5

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

Wire bonds of thick-film conductors : S.

Wire bonds of thick-film conductors : S. Goldfarb. Proc. 21st Electronics Components Conf., Washington DC, USA, 10–12 May (1971), p. 295

📂 Article 📅 1972 🏛 Elsevier Science 🌐 English ⚖ 111 KB

Photoformed plated interconnection of em

Photoformed plated interconnection of embedded IC chips : E. A. Guditz and R. L. Burke. Proc. 21st Electronic Components Conf., Washington DC, USA, 10–12 May (1971), p. 137

📂 Article 📅 1972 🏛 Elsevier Science 🌐 English ⚖ 105 KB

Developments in copper alloys for semico

Developments in copper alloys for semiconductor connectors and packages : S. H. Butt. Proc. 21st Electronic Components Conf., Washington DC, USA, 10–12 May (1971), p. 103

📂 Article 📅 1972 🏛 Elsevier Science 🌐 English ⚖ 105 KB

Production of a hybrid integrated circui

Production of a hybrid integrated circuit for PICTUREPHONE® service : J. R. Bitler and A. R. Gerhard. Proc. 21st Electronic Components Conf., Washington DC, USA, 10–12 May (1971), p. 221

📂 Article 📅 1972 🏛 Elsevier Science 🌐 English ⚖ 108 KB

An approach to a standard topology for d

An approach to a standard topology for digital hybrid integrated circuits : E. H. Mayer and G. M. Nemetz. Proc. 21st Electronic Components Conf., Washington DC, USA, 10–12 May (1971), p. 538

📂 Article 📅 1972 🏛 Elsevier Science 🌐 English ⚖ 107 KB

Production method for aluminum beam lead

Production method for aluminum beam leads on ceramic substrates : R. E. McMahon, F. J. Bachner, R. A. Cohen, W. S. Franklin and J. D. Impey. Proc. 21st Electronic Components Conf., Washington DC, USA, 10–12 May (1971), p. 96

📂 Article 📅 1972 🏛 Elsevier Science 🌐 English ⚖ 107 KB