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Reliability of composite solder bumps produced by an in-situ process

✍ Scribed by Jong-Hyun Lee; Daejin Park; Jong-Tae Moon; Yong-Ho Lee; Dong Hyuk Shin; Yong-Seog Kim

Book ID: 107452379
Publisher: Springer US
Year: 2000
Tongue: English
Weight: 402 KB
Volume: 29
Category: Article
ISSN: 0361-5235
DOI: 10.1007/s11664-000-0022-7

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