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Reliability investigations on conductive adhesive joints with emphasis on the mechanics of the conduction mechanism

โœ Scribed by Dudek, R.; Berek, H.; Fritsch, T.; Michel, B.


Book ID
120567855
Publisher
IEEE
Year
2000
Tongue
English
Weight
645 KB
Volume
23
Category
Article
ISSN
1521-3331

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๐Ÿ“œ SIMILAR VOLUMES


Fundamental understanding of ACF conduct
โœ Woon-Seong Kwon; Kyung-Wook Paik ๐Ÿ“‚ Article ๐Ÿ“… 2004 ๐Ÿ› Elsevier Science ๐ŸŒ English โš– 324 KB

This paper presents the thermal and mechanical contribution of anisotropic conductive films (ACFs) to the electrical conduction establishment of ACF joint. The conduction mechanism of ACF joint strongly depends on the thermal and mechanical properties of ACF. Therefore, it is important to understand