✦ LIBER ✦
Reliability improvement of aluminium-based contact and interconnect systems for VLSI applications by grain structure modification
✍ Scribed by T Streil; B Sauer; K Frommhagen; Ch Kunath; P Huebler; M Kotzerke
- Publisher
- Elsevier Science
- Year
- 1992
- Tongue
- English
- Weight
- 631 KB
- Volume
- 18
- Category
- Article
- ISSN
- 0167-9317
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