Reliability evaluations for board-level chip-scale packages under coupled power and thermal cycling test conditions

✍ Scribed by Tong Hong Wang; Yi-Shao Lai; Yu-Cheng Lin

• Publisher: Elsevier Science
• Year: 2008
• Tongue: English
• Weight: 870 KB
• Volume: 48
• Category: Article
• ISSN: 0026-2714
• DOI: 10.1016/j.microrel.2007.02.011