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Reliability evaluation of bonding wires in power transistor modules under power cycling test : Kohji Ohga et al. Proceedings of the 21st Symposium on Reliability and Maintainability, Japan, 212 (June 1991)


Publisher
Elsevier Science
Year
1992
Tongue
English
Weight
137 KB
Volume
32
Category
Article
ISSN
0026-2714

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