Reliability computer-aided design tool for full-chip electromigration analysis and comparison with different interconnect metallizations

✍ Scribed by Syed M. Alam; Chee Lip Gan; Carl V. Thompson; Donald E. Troxel

• Publisher: Elsevier Science
• Year: 2007
• Tongue: English
• Weight: 815 KB
• Volume: 38
• Category: Article
• ISSN: 0026-2692
• DOI: 10.1016/j.mejo.2006.11.017