๐”– Bobbio Scriptorium
โœฆ   LIBER   โœฆ

Reliability challenges in the nanoelectronics era

โœ Scribed by A.J. van Roosmalen; G.Q. Zhang


Book ID
108210637
Publisher
Elsevier Science
Year
2006
Tongue
English
Weight
596 KB
Volume
46
Category
Article
ISSN
0026-2714

No coin nor oath required. For personal study only.


๐Ÿ“œ SIMILAR VOLUMES


A new ERA in reliability
โœ Nicholas Balke ๐Ÿ“‚ Article ๐Ÿ“… 1979 ๐Ÿ› Elsevier Science ๐ŸŒ English โš– 34 KB
Reliability challenges in 3D IC packagin
โœ K.N. Tu ๐Ÿ“‚ Article ๐Ÿ“… 2011 ๐Ÿ› Elsevier Science ๐ŸŒ English โš– 840 KB

At the moment, a major paradigm change, from 2D IC to 3D IC, is occurring in microelectronic industry. Joule heating is serious in 3D IC, and vertical interconnect is the critical element to be developed. Also reliability concerns will be extremely important. For example, in order to remove heat, a