Release of interfacial thermal stress and accompanying improvement of interfacial adhesion in carbon fiber reinforced epoxy resin composites: Induced by diblock copolymers

✍ Scribed by Shuanghui Deng; Xiaodong Zhou; Chuanjie Fan; Qunfang Lin; Xinggui Zhou

• Book ID: 116378915
• Publisher: Elsevier Science
• Year: 2012
• Tongue: English
• Weight: 920 KB
• Volume: 43
• Category: Article
• ISSN: 1359-835X
• DOI: 10.1016/j.compositesa.2012.01.004