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Relationship between thermal properties and diffusion coefficients of gases for polyimide films

✍ Scribed by Hiroyuki Tsuzumi; Keio Toi; Tomoyasu Ito; Tetsuo Kasai

Publisher
John Wiley and Sons
Year
1997
Tongue
English
Weight
277 KB
Volume
64
Category
Article
ISSN
0021-8995

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✦ Synopsis

The relationships between the chemical structure, packing density (1/V F ), and cohesive energy density (CED) and the thermal properties of polyimides were investigated. Particularly, the correlation of tan d measured by stress-strain/thermal mechanical analysis with 1/V F and CED was found for eight polyimides. We measured the relationship between the apparent diffusion coefficient ( D a ) and 1/V F and CED, respectively, as described in previous articles. From these experiments, we found that the thermal properties, especially tan d, were correlated with the apparent diffusion coefficient of gas. These results are well explained by use of micro-Brownian motion.

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Three different semi-IPN polyimide systems were prepared through blending in solution by using two different polyimides, such as poly (p-phenylenebiphenyl tetracarbonyimide) (BPDA-PDA) and poly (4,4Ј-oxydiphylene pyromellitimide) [PMD-A-ODA(E)], and two different oligomers, such as bismaleimide (MDA