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Relationship between mechanical properties and microstructure of ultra-fine gold bonding wires

✍ Scribed by K.S. Kim; J.Y. Song; E.K. Chung; J.K. Park; S.H. Hong

Publisher: Elsevier Science
Year: 2006
Tongue: English
Weight: 478 KB
Volume: 38
Category: Article
ISSN: 0167-6636
DOI: 10.1016/j.mechmat.2005.05.015

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