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Relationship between elastic behavior and interfacial bonding strength for carbon fiber reinforced copper composites

✍ Scribed by Y. Z. Wan; Y. L. Wang; H. L. Luo; G. X. Cheng


Book ID
110240420
Publisher
Springer
Year
2000
Tongue
English
Weight
33 KB
Volume
19
Category
Article
ISSN
0261-8028

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The effect of strong carbide forming elements (Ti, Zr) in the Cu matrix on interfacial bonding and electric conductivity of CNF/Cu composites has been studied. The chemical bonding states of C/Cu interfaces were calculated by using the first-principles molecular orbital method, which showed that the