Copper electroless deposition technology
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Yosi Shacham-Diamand; Valery M. Dubin
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Article
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1997
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Elsevier Science
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English
⚖ 711 KB
In this paper we present the technology of electroless Cu deposition for ultra-large-scale integration. The technology has several components: the solution chemistry, the operation conditions, the seeding, the equipment and the process integration. Sodium-free solution was used and optimized to achi