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Reengineering and the development of a decision support system for printed wiring board assembly

✍ Scribed by Bard, J.F.; Feo, T.A.; Holland, S.D.

Book ID
114539196
Publisher
IEEE
Year
1995
Tongue
English
Weight
829 KB
Volume
42
Category
Article
ISSN
0018-9391

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The Alternative Assembly and Reflow Technology (AART) process allows for the concurrent reflow soldering of through hole and surface mount components on to a Printed Circuit Board (PCB) assembly. The implementation of the AART process will preclude the need for wave and/or manual soldering. Prior to