✦ LIBER ✦
Reducing environmental impact and increasing reliability through packaging: A lifecycle assessment approach
✍ Scribed by John P. Franey; Thomas A. Okrasinski; William J. Schaeffer Sr.
- Publisher
- Institute of Electrical and Electronics Engineers
- Year
- 2010
- Tongue
- English
- Weight
- 126 KB
- Volume
- 15
- Category
- Article
- ISSN
- 1089-7089
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