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Recovery of copper, tin and lead from the spent nitric etching solutions of printed circuit board and regeneration of the etching solution

โœ Scribed by Man-Seung Lee; Jong-Gwan Ahn; Jae-Woo Ahn

Book ID
108431684
Publisher
Elsevier Science
Year
2003
Tongue
English
Weight
161 KB
Volume
70
Category
Article
ISSN
0304-386X

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๐Ÿ“œ SIMILAR VOLUMES

Leaching and electrochemical recovery of
Leaching and electrochemical recovery of copper, lead and tin from scrap printed circuit boards
โœ Andrea Mecucci; Keith Scott ๐Ÿ“‚ Article ๐Ÿ“… 2002 ๐Ÿ› Wiley (John Wiley & Sons) ๐ŸŒ English โš– 158 KB

## Abstract The recovery of copper, lead and tin from scrap printed circuit boards (PCBs) has been achieved using a combination of leaching, electrochemical ion exchange and electrodeposition. A simple aqueous nitric acid stripping solution, with the concentration range of 1โ€“6โ€‰molโ€…dm^โˆ’3^, has demon