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Reconstruction and thermal performance analysis of die-bonding filling states for high-power light-emitting diode devices

✍ Scribed by Li, Zongtao; Tang, Yong; Ding, Xinrui; Li, Cheng; Yuan, Dong; Lu, Yifan

Book ID: 121464169
Publisher: Elsevier Science
Year: 2014
Tongue: English
Weight: 735 KB
Volume: 65
Category: Article
ISSN: 1359-4311
DOI: 10.1016/j.applthermaleng.2014.01.004

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