Recent Development of Advanced Functional Polymers for Semiconductor Encapsulants of Integrated Circuit Chips and High-temperature Photoresist for Electronic Applications
✍ Scribed by Naoya Yoda
- Publisher
- John Wiley and Sons
- Year
- 1997
- Tongue
- English
- Weight
- 481 KB
- Volume
- 8
- Category
- Article
- ISSN
- 1042-7147
No coin nor oath required. For personal study only.
✦ Synopsis
A new polymer system of semiconductor devices was studied in response to the multifunctional systems evolved. A variety of functional polymers have been developed in the manufacture of semiconductor and integrated circuit (IC) packaging devices by R&D of hightemperature polymers. With the increase in integration of electronic devices and the need to reduce overall size, market needs are moving to multilevel metallization. Toray's core polymer technologies for electronic devices in the past 35 years are reviewed.
The new technology of IC encapsulants of biphenyl type epoxy compounds is described for the new generation 16 megabits dynamic randon accessory memory (DRAM) electronic memory device, with good heat dissipation characteristics and low stress with an anti-flammability UL V-0 property of halogen-free formulation. As core functions are built into devices, packaging and mount technologies become more important.
A new photosensitive high-temperature polymer stable up to 500ЊC with photosensitivity and high resolution has been developed. The trend toward a high degree of integration in solid-state technology requires the use of new high-temperature photosensitive insulating materials. Toray's "Photoneece" system provides such versatile polyimide pattern-generation techniques, containing a unique photosensitive polyimide precursor which can be