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Reactions of lead-free solders with CuNi metallizations

✍ Scribed by T. M. Korhonen; P. Su; S. J. Hong; M. A. Korhonen; C. -Y. Li

Book ID: 107452369
Publisher: Springer US
Year: 2000
Tongue: English
Weight: 366 KB
Volume: 29
Category: Article
ISSN: 0361-5235
DOI: 10.1007/s11664-000-0012-9

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