Reaction Phases at the Interfaces Between a Cu Filler, an Intermediate Ti Layer, and Si3N4

✍ Scribed by W. Dümmler; S. Weber; C. Tête; S. Scherrer

• Book ID: 110238596
• Publisher: Springer
• Year: 1999
• Tongue: English
• Weight: 113 KB
• Volume: 18
• Category: Article
• ISSN: 0261-8028
• DOI: 10.1023/a:1006607711814