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Radiation response of CMOS/SOI devices formed by wafer bond and etchback

✍ Scribed by Palkuti, L.J.; Ling, P.; Leonov, P.; Kawayoshi, H.; Ormond, R.; Yuan, J.

Book ID: 114554652
Publisher: IEEE
Year: 1988
Tongue: English
Weight: 463 KB
Volume: 35
Category: Article
ISSN: 0018-9499
DOI: 10.1109/23.25515

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