✦ LIBER ✦
Quantitative X-ray microtomography study of 3-D void growth induced by electromigration in eutectic SnPb flip-chip solder joints
✍ Scribed by Tian Tian; Kai Chen; A.A. MacDowell; Dula Parkinson; Yi-Shao Lai; K.N. Tu
- Book ID
- 113899123
- Publisher
- Elsevier Science
- Year
- 2011
- Tongue
- English
- Weight
- 429 KB
- Volume
- 65
- Category
- Article
- ISSN
- 1359-6462
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