Quantitative reliability analysis of flip–chip packages under thermal–cyclic loading and in consideration of parameter uncertainties

✍ Scribed by Yao Hsu; Chih-Yen Su; Wen-Fang Wu

• Book ID: 113800471
• Publisher: Elsevier Science
• Year: 2011
• Tongue: English
• Weight: 445 KB
• Volume: 51
• Category: Article
• ISSN: 0026-2714
• DOI: 10.1016/j.microrel.2011.04.019