Quantitative comparison of electronic component/solder joint stress relief in encapsulated assemblies : Dennis A. Cummings. IEEE Trans. Components, Hybrids, Mfg Technol.Chmt-2, (4) 454 (December 1979)

• Book ID: 103274752
• Publisher: Elsevier Science
• Year: 1980
• Tongue: English
• Weight: 133 KB
• Volume: 20
• Category: Article
• ISSN: 0026-2714
• DOI: 10.1016/0026-2714(80)90104-3