Quantitative characterization of electromigration-induced plastic deformation in Al(0.5wt%Cu) interconnect

✍ Scribed by R.I Barabash; G.E Ice; N Tamura; B.C Valek; J.C Bravman; R Spolenak; J.R Patel

• Publisher: Elsevier Science
• Year: 2004
• Tongue: English
• Weight: 294 KB
• Volume: 75
• Category: Article
• ISSN: 0167-9317
• DOI: 10.1016/j.mee.2003.09.009