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Pyrolysis of some commercial phenol-formaldehyde bonding agents

✍ Scribed by N. I. Makarevich; N. I. Sushko; A. I. Ivanov; E. N. Lingart; T. I. Glazova; L. M. Prutkov


Publisher
Springer US
Year
1977
Tongue
English
Weight
461 KB
Volume
26
Category
Article
ISSN
0021-9037

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The effects of temperature and relative humidity on phenol-formaldehyde resin bonding were evaluated. Two flakes in a lap-shear configuration were bonded under an environment of controlled temperature (110 ~ 120 ~ 130 ~ 140 ~ and relative humidity (41%, 75%, 90%) for a series of time periods (0.25 t