Pulse-plating of AuCuCd alloys—I. Experiments under controlled mass transport conditions

✍ Scribed by A. Ruffoni; D. Landolt

• Publisher: Elsevier Science
• Year: 1988
• Tongue: English
• Weight: 613 KB
• Volume: 33
• Category: Article
• ISSN: 0013-4686
• DOI: 10.1016/0013-4686(88)80115-4

✦ Synopsis

Pulse-plating of Au-Cu-Cd alloys under controlled steady state and non steady state mass transport conditions has been studied using an additive free cyanide electrolyte and a rotating hemispherical electrode . Average current densities ranged from 10 mA cm -' to 1 A cm -', pulse current densities from 50 mA cm -' to 10 A cm -' and pulse times from 0.2 to 100 ms . The influence of applied pulse parameters on alloy composition was determined. In addition, potential transients were measured and the resulting deposits were studied optically and/or with the Scanning electron microscope. Results show that the composition of the deposited alloys and their aspect depends strongly on the choice of applied pulse-parameters.

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