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Properties of Thermal Conductivity on Polyimide/Clay Nanocomposite Foams

✍ Scribed by Kim, Eunk Young; Jeong, Seung Yong; Shin, Gyo Jic; Lee, Sang Kug; Choi, Kyung Ho

Book ID
120928696
Publisher
Trans Tech Publications Inc.
Year
2012
Tongue
English
Weight
460 KB
Volume
229-231
Category
Article
ISSN
1660-9336

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## Abstract Polymer‐clay nanocomposites are well‐known high‐performance materials with a superior tensile modulus. However, in the case of composites with polyimide (PI), additional functions require study because PI is a high‐performance material in itself. Significant enhancement of thermal condu