Properties of the passive films present on copper and copper-nickel alloys in slightly alkaline solutions
✍ Scribed by S. Ceré; M. Vázquez
- Book ID
- 110336584
- Publisher
- Springer
- Year
- 2002
- Tongue
- English
- Weight
- 61 KB
- Volume
- 21
- Category
- Article
- ISSN
- 0261-8028
No coin nor oath required. For personal study only.
📜 SIMILAR VOLUMES
## Abstract The passivity of copper in NaOH and borate buffer solutions containing chloride, bromide and fluoride ions was studied by using cyclic voltammetry and potentiostatic current transient measurements. At scan rates ≥ 20 mVs^−1^, the addition of halide ions does not nearly affect the cyclic
## Abstract Erosion–corrosion tests on copper and three types of copper alloys in a 1 wt% solution of CuCl~2~ were carried out at various flow velocities using a jet‐in‐slit testing apparatus, which is capable of reproducing various hydrodynamic conditions. A damage profile of a specimen was develo
Zinc dissolution and passivation in either arsenate or borate and a mixture of arsenate-borate solutions at pH 8.9 was studied by polarization curves and cyclic voltammetry. The arsenate anion produces an increase on zinc dissolution . Potential sweep rate, rotation speed, temperature, dissolved oxy
Galvanostatic cyclic anodic and cathodic polarization curves of seven copper-tin alloys were traced on O-01, O-1 and 2N NaOH solutions at 25". The tin content of the alloys was varied between 8 and 76 wt-%. The results obtained are explained in relation to the phase diagram of the copper-tin system.