Progress and developments in the field of materials for transient liquid phase bonding and active soldering processes

✍ Scribed by E. Lugscheider; S. Ferrara; H. Janssen; A. Reimann; B. Wildpanner

• Publisher: Springer-Verlag
• Year: 2004
• Tongue: English
• Weight: 238 KB
• Volume: 10
• Category: Article
• ISSN: 0946-7076
• DOI: 10.1007/s00542-003-0351-6