No coin nor oath required. For personal study only.
This invention relates to a method for hermetically encapsulating an electronic component that is mounted in flip-chip design on a support. The method described is characterized by first covering the component with a film, which closely rests on the component and the support, then structuring the film, and providing a hermetic sealing layer, especially a metal layer, which creates a seal with the support.
๐ SIMILAR VOLUMES
the embedding of a process signature provides smart packaging, which can guarantee package health (even weeks after the sealing process). This means that the practice (in certain areas) of product quarantine and re-inspection is avoided, with significant cost savings.
## Engineered sealing solutions for automotive aftermarket applications To compete in a growing marketplace, automotive aftermarket component manufacturers need top-quality, competitively priced seals and sealing systems. They also need access to design assistance and fast, reliable delivery. Parke
Freudenberg-NOK GP,