Processing condition for the development of cube texture in Ni and Ni alloy tapes fabricated by powder metallurgy process

Development of cube textured Ni–5at.%W a

Development of cube textured Ni–5at.%W alloy substrates for YBCO coated conductor application using a powder metallurgy process

✍ S.-S. Kim; J.-S. Tak; S.-Y. Bae; J.-K. Chung; I.-S. Ahn; C.-J. Kim; K.-W. Kim; K 📂 Article 📅 2007 🏛 Elsevier Science 🌐 English ⚖ 830 KB

In this paper, Ni-5at.%W alloy substrate for YBCO coated conductor was fabricated by a dry powder metallurgy process including powder compaction, cold isostatic pressing (CIP), cold rolling and annealing for recrystallization. Ni and W powders were ball-milled at this process for various times of 10