✦ LIBER ✦
Process parameters for bonding copper powder to oxygen free high conductivity (OFHC) copper substrate by CIP and sintering : G.A. Rao et al, (Defence Materials Research Laboratory, Hyderabad, India), Trans PM Assoc. of India, Vol 18, 1991, 27–30
- Book ID
- 116032082
- Publisher
- Elsevier Science
- Year
- 1992
- Tongue
- English
- Weight
- 130 KB
- Volume
- 47
- Category
- Article
- ISSN
- 0026-0657
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