✦ LIBER ✦
Process and design tradeoffs between minimum RC signal propagation delay and interconnect current density and resistance for deep submicrometer ICs
✍ Scribed by Inohara, M.; Toyoshima, Y.
- Book ID
- 114618027
- Publisher
- IEEE
- Year
- 2005
- Tongue
- English
- Weight
- 415 KB
- Volume
- 52
- Category
- Article
- ISSN
- 0018-9383
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